Finnfoam - extruded polystyrene Finnfoam XX wafer structure
Price on request
Product description
When insulating the building structure, it is very important that the thermal insulation materials stick to the insulated surface well. It is also important that reinforced layer and decorative plaster are glued to the boards. Finnfoam proposes to use boards with an embossed surface called Finnfoam XX. A waffle-like surface gives better adhesion to the insulated surface or plaster. Due to the embossed surface, Finnfoam XX boards are ideally suited for insulating plinths, lintels, columns, walls and other plastered structures. Possible panel dimensions: 600 x 1250 mm, thickness: 20, 30, 50, 80, 100, 120 mm. Finnfoam XX boards are used for insulation of plinths, lintels, columns, thermal bridges, as well as for insulation and construction of walls and other constructions for which good adhesion with glued surface or plaster is needed.
Technical data
- compressive strength (10% deformations).:
- ≥300 kPa
- compressive strength (long-term period 50 years) (2% strain):
- 130 kPa
- thermal conductivity λ:
- 0,031-0,037 W/mK